Procesor AMD Phenom II Dual-Core N620 HMN620DCR23GM, socket S1, 2.8GHz
AMD Phenom II N620 specifications
General information

Type CPU / Microprocessor
Market segment Mobile
Family AMD Phenom II Dual-Core Mobile
Model number ? N620
CPU part number

HMN620DCR23GM is an OEM/tray microprocessor

Stepping codes AAEGC AE NAEGC AE
Frequency ? 2800 MHz
Bus speed ? One 1800 MHz 16-bit HyperTransport link
Clock multiplier ? 14
Package 638-pin micro-PGA
AMD Package number 30600
Socket Socket S1 (S1g4)
Size 1.38" x 1.38" / 3.5cm x 3.5cm
Weight 0.2oz / 5.6g
Introduction date May 12, 2010

Architecture / Microarchitecture

Microarchitecture K10
Platform Danube
Processor core ? Champlain
Core stepping ? DA-C3
CPUID 100F63
Manufacturing process 0.045 micron SOI
Data width 64 bit
The number of cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
Level 2 cache size ? 2 x 1 MB 16-way set associative caches
Level 3 cache size None
Cache latency 3 (L1 cache)
15 (L2 cache)
Multiprocessing Uniprocessor
Features

MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
AMD64 / AMD 64-bit technology ?
EVP / Enhanced Virus Protection ?
VT / Virtualization technology ?

Low power features PowerNow!

Integrated peripherals / components

Integrated graphics None
Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333

Other peripherals HyperTransport technology 3.0

Electrical / Thermal parameters

Thermal Design Power ? 35 Watt
Pret 90 RON
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Intel® Core™ i3-350M Processor
(3M Cache, 2.26 GHz)

Specifications
-
Essentials
Status End of Interactive Support
Launch Date Q1'10
Processor Number i3-350M
# of Cores 2
# of Threads 4
Clock Speed 2.26 GHz
Intel® Smart Cache 3 MB
DMI 2.5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1, SSE4.2
Embedded Options Available
No
Lithography 32 nm
Max TDP 35 W
Recommended Customer Price N/A
Datasheet Link
-
Memory Specifications
Max Memory Size (dependent on memory type) 8 GB
Memory Types DDR3-800/1066
# of Memory Channels 2
Max Memory Bandwidth 17.1 GB/s
Physical Address Extensions 36-bit
ECC Memory Supported ‡
No
-
Graphics Specifications
Processor Graphics ‡ Intel® HD Graphics
Graphics Base Frequency 500 MHz
Graphics Max Dynamic Frequency 667 MHz
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Clear Video HD Technology Yes
Intel® Clear Video Technology Yes
Macrovision* License Required No
# of Displays Supported ‡ 2
-
Expansion Options
PCI Express Revision 2.0
PCI Express Configurations ‡ 1x16
Max # of PCI Express Lanes 16
-
Package Specifications
Max CPU Configuration 1
TJUNCTION 90°C for rPGA, 105°C for BGA
Package Size rPGA 37.5mmx 37.5mm, BGA 34mmx28mm
Processing Die Size 81 mm2
# of Processing Die Transistors 382 million
Graphics and IMC Lithography 45 nm
Graphics and IMC Die Size 114 mm2
# of Graphics and IMC Die Transistors 177 million
Sockets Supported BGA1288, PGA988
Low Halogen Options Available See MDDS
-
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® vPro Technology ‡
No
Intel® Hyper-Threading Technology ‡
Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
No
Intel® VT-x with Extended Page Tables (EPT) ‡
Yes
Intel® 64 ‡
Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology
Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
-
Intel® Data Protection Technology
AES New Instructions
No
-
Intel® Platform Protection Technology
Trusted Execution Technology ‡
No
Execute Disable Bit ‡ Yes
Pret. 100 Ron
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Intel® Pentium® Processor P6100
(3M Cache, 2.00 GHz)

Specifications
-
Essentials
Status End of Interactive Support
Launch Date Q3'10
Processor Number P6100
# of Cores 2
# of Threads 2
Clock Speed 2 GHz
Intel® Smart Cache 3 MB
DMI 2.5 GT/s
Instruction Set 64-bit
Embedded Options Available
No
Lithography 32 nm
Max TDP 35 W
Recommended Customer Price N/A
Datasheet Link
-
Memory Specifications
Max Memory Size (dependent on memory type) 8 GB
Memory Types DDR3-800/1066
# of Memory Channels 2
Max Memory Bandwidth 17.1 GB/s
Physical Address Extensions 36-bit
ECC Memory Supported ‡
No
-
Graphics Specifications
Processor Graphics ‡ Intel® HD Graphics
Graphics Base Frequency 500 MHz
Graphics Max Dynamic Frequency 667 MHz
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Clear Video Technology Yes
Macrovision* License Required No
# of Displays Supported ‡ 2
-
Expansion Options
PCI Express Revision 2.0
PCI Express Configurations ‡ 1x16
Max # of PCI Express Lanes 1
-
Package Specifications
Max CPU Configuration 1
TJUNCTION 90°C
Package Size 37.5mmx37.5mm
Processing Die Size 81 mm2
# of Processing Die Transistors 382 million
Graphics and IMC Lithography 45 nm
Graphics and IMC Die Size 114 mm2
# of Graphics and IMC Die Transistors 177 million
Sockets Supported PGA988
Low Halogen Options Available See MDDS
-
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® vPro Technology ‡
No
Intel® Hyper-Threading Technology ‡
No
Intel® Virtualization Technology (VT-x) ‡ No
Intel® 64 ‡
Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
-
Intel® Data Protection Technology
AES New Instructions
No
-
Intel® Platform Protection Technology
Trusted Execution Technology ‡
No
Execute Disable Bit ‡ Yes

Pret . 100 Ron

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